1
/
of
6
Kaisi K-310 Double Headed Crowbar High Toughness Blade Set
Kaisi K-310 Double Headed Crowbar High Toughness Blade Set
No reviews
Em promoção
Esgotado
Pre-order
Preço normal
R 379.00
Preço normal
Preço de saldo
R 379.00
Preço unitário
/
por
Envio calculado na finalização da compra.
Ships in 1-3 Days
Estimated delivery:
✓ Delivered Duty Paid: No additional customs charges. All duties and taxes are included.
Não foi possível carregar a disponibilidade de recolha
Guaranteed Safe Checkout
Guaranteed Safe Checkout
Descrição
1. The blade is made of special steel, laser cutting, manual polishing, moderate hardness, flexibility, comfortable feel, hardness, and toughness
2. Separation of dot matrix, glue removal from the bottom of the board, wire break assistance, removal of large chips
3. It is suitable for separating dot-matrix/board bottom glue removal/large chip removal/disconnection assistance, etc., to meet your maintenance needs
4. The blade is hardened, the cutting edge is ultra-thin, the slope on both sides is polished at the same time, and the blade is evenly stressed on both sides from thick to thin
5. Super toughness, better protection of mobile phone chips
6. With a universal handle, high-quality material selection, and a strong guarantee of product quality
7. Mobile phone repair commonly used blades, hard disk removal, removal of mobile phone chips, motherboard CPU layering
2. Separation of dot matrix, glue removal from the bottom of the board, wire break assistance, removal of large chips
3. It is suitable for separating dot-matrix/board bottom glue removal/large chip removal/disconnection assistance, etc., to meet your maintenance needs
4. The blade is hardened, the cutting edge is ultra-thin, the slope on both sides is polished at the same time, and the blade is evenly stressed on both sides from thick to thin
5. Super toughness, better protection of mobile phone chips
6. With a universal handle, high-quality material selection, and a strong guarantee of product quality
7. Mobile phone repair commonly used blades, hard disk removal, removal of mobile phone chips, motherboard CPU layering