QIANLI

For Honor Magic3 Pro Qianli Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform

Name: For Honor Magic3 Pro Qianli Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform
Brand: QIANLI
SKU: EDA004470310
Price: 479.00 ZAR
Availability: InStock

R 479.00

Em promoção Esgotado

Envio calculado na finalização da compra.

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FREE SHIPPING on all orders. Fully Insured.

Handling time 1 - 3 working days. (PMC has to process your order and put all your items through its strict quality-control tests.)

Transit time 7 - 15 working days.

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Pay using Mobicred. Simply choose Peach Payment >> Mobicred at checkout, and we’ll ship it once the order is approved.

Return Guarantee

For whatever reason if you are unsatisfied with your order within 7 days you can return it to us in new condition for a refund minus the shipping charges.

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Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.

Missing/Wrong Items Guarantee

If you receive a parcel with missing/incorrect/secondary packing items, please contact us within 7 days of delivery and provide the relevant proof. PMC will make compensation based on the damage situation.

1. Strong magnetic universal base, various models for more expansions of reballing
2. Applicable to Mega-idea Multi-functional Middle Frame Reballing Platform Use with the base will update more models
3. Strong magnetic universal base with three strong magnetic magnet
4. Universal base for all models, a lifetime experience in one purchase
5. Replace and add up updated models for more expansions
6. Models keep updating, add up without limits, free from base replacements
7. CNC high precision one-piece machining, stable positioning of the motherboard, no slanting when reballing
8. Anti-slip foot pad of the base, two anti-slip silicone foot pads, avoid slippery during reballing
9. Detailed process in each step of reballing, secure clamping of the motherboards in high temperatures
10. Avoid the large area of mesh detaching at the same time, resulting in solder paste being carried away