i2C T18 LCD Display PCB Motherboard Layered Desoldering Station For iPhone X-15 Pro Max, US Plug
i2C T18 LCD Display PCB Motherboard Layered Desoldering Station For iPhone X-15 Pro Max, US Plug
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R526.68/mo 3 months
- R266.32/mo 6 months
- R140.55/mo 12 months
- From R526.68/month over 3 months, or as low as R140.55/month over 12. Total repayable over 12 months: R1686.6. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
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6-13 business days
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Description
The i2C T18 LCD Display PCB Motherboard Layered Desoldering Station is a repair platform designed for motherboard separation and bonding. It is suitable for tasks such as chip CPU glue removal and desoldering for iPhone X to 15 Pro Max models.
- Product Type: Repair Platform
- Model: T18
- Compatibility: iPhone X-15 Pro Max
- Material: Aviation aluminum
- Color/Variant: N/A
- Minimum Temperature: 180°C
- Maximum Temperature: 245°C
- Display: LED digital display
- Body Size: 13.4 x 11.6 x 1.7 cm
- Key Feature: Magnetic modular design
- Heating Technology: PTC ceramic heating pieces
- Heating Time: Heats up to 180°C in 60 seconds
- Temperature Adjustment: 2 gears
- Functionality: Supports chip CPU glue removal and desoldering
- Module Compatibility: Supports multiple modules and double-layer motherboard layering
- Application: Suitable for various precision electronic and digital product repairs
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