AMAOE 0.12mm Reballing Stencil For Face ID IC
AMAOE 0.12mm Reballing Stencil For Face ID IC
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R86.33/mo 3 months
- R43.66/mo 6 months
- R23.04/mo 12 months
- From R86.33/month over 3 months, or as low as R23.04/month over 12. Total repayable over 12 months: R276.48. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
Continue to checkoutDon't have Mobicred yet? Apply free — takes about 2 minutes →
Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Included
6-13 business days
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Processing time: 1-3 days
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Description
AMAOE 0.12mm Reballing Stencil is a BGA stencil designed for high-precision IC chip repairs. It is suitable for Apple chip models, improving reballing success rates and ensuring optimal performance.
- Product Type: BGA Stencils
- Compatibility: Apple chip models including CPUs, basebands, power management ICs, and other common chips
- Material: Stainless steel
- Color/Variant: Silver
- Key Feature: Ultra-thin design (0.12mm)
- Heat Resistance: Excellent
- Corrosion Resistance: Excellent
- Durability: Highly durable and wear-resistant
- Reuse Cycles: Capable of withstanding hundreds of reuse cycles under normal conditions
- Cleaning: Easy to clean
- Cutting Technology: Laser micron-level cutting technology
- Aperture Sizes: Uniform sizes for accurate solder ball alignment
- Operation: Precisely aligned hole positions for quick and easy operation
- Efficiency: Improves reballing efficiency and reduces rework rates
- Intended Use: High-precision IC chip repairs
- Cost-Effectiveness: Significantly lowers repair costs
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